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| In ICU, MEMS-based 1st level camera integration approaches will be investigated to reduce the cost for the infrared camera assembly. Wafer-level camera integration is already being implemented for CMOS imagers (imaging in the visible light spectrum) targeting high-volume applications. For FIR cameras, however, there are issues to consider related to material choise and design with respect to feasible assembling processes. The target is to fabricate an initial prototype of a sensor chip with integrated optics in order to demonstrate the concepts. |
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