Wafer-Level Vacuum Packaging of Bolometer Array
The principle of how the cap-wafer is attached to the ROIC wafer with the pixels inside a separate cavity sealed in vacuum.
Reliability and cost of micro systems are heavily related to the encapsulation techniques chosen. In the ICU project we develop a wafer-level package to form lids with an IR-window over the bolometer pixel array. This technology allows the pixels to be packaged in a hermetic cavity with the electrical contacts outside the cavity at low cost. As a result, this also allows the bolometer chip to be integrated directly to the camera housing, hereby reducing the system cost even more. Wafer-level packaging technology has already proven its ability to secure vacuum and high reliability in other demanding applications like automotive Tire Pressure Monitoring (TPM) and Gyro’s for the last 10 years. | 
